

2026 EMSOFT : International Conference on Embedded Software
EMSOFT 2026
✦
✧
会议简介
✦
嵌入式系统周 (ESWEEK) 是涵盖智能互联嵌入式、边缘和网络物理系统硬件和软件设计各个方面的顶级盛会。ESWEEK 汇集了三大国际领先会议(CASES、CODES 和 EMSOFT)、一个专题研讨会(MEMOCODE)以及多个工作坊和教程,使与会者能够受益于涵盖嵌入式系统研发领域最前沿技术的广泛主题。
一次注册,畅享三大会议!
已注册的与会者可以参加ESWEEK三大会议(CASES、CODES 和 EMSOFT)的任何环节。请注意,教程、专题研讨会(MEMOCODE)和workshop可能需要单独注册。
会议全称:2026年国际嵌入式软件会议(EMSOFT 2026)
会议日期:2026年10月4日-9日
会议地点:西班牙,巴塞罗那
会议网站:http://esweek.org/emsoft/
✦
✧
会议组委会
Conference and Local Arrangement Chair
Francisco J. Cazorla, Barcelona Supercomputing Center, Spain
Local Arrangement Co-Chair
Sergi Abadal (UPC, Spain) and Jaume Abella (BSC, Spain)
Finance Chair
Angeliki Kritikakou, University of Rennes 1, IRISA/INRIA, FR
Special Sessions Chairs
Francesco Regazzoni, University of Amsterdam
NLBenny Akesson, University of Amsterdam and TNO-ESI, NL
Panel Chair
Andreas Gertstlauer, University of Texas at Austin, US
Workshops Chairs
Pi-Cheng Hsiu, Academia Sinica, TW
Kasım Sinan Yıldırım, University of Trento, IT
Tutorials Chair
Ming-Chang Yang, The Chinese University of Hong Kong, HK
Education Chairs
Marcello Traiola, Inria centre at Rennes University
FRAnuj Pathania, University of Amsterdam, NL
Awards Chair
Xiaobo Sharon Hu, University of Notre Dame, US
Student Competition Chairs
Ganapati Bhat, Washington State University, US
Biresh Kumar Joardar, University of Houston, US
Ph.D. Forum & Recruitment Chairs
Leonidas Kosmidis, BSC, Spain
Dolly Sapra, University of Amsterdam, NL
Publication Chairs
Gang Quan, Florida International University, US
Bryan Donyanavard, San Diego State University, US
Web Chair
Christian Hakert, TU Dortmund, DE
Registration Chairs
Man-Ki Yoon, North Carolina State University, US
Chun-Feng Wu, National Yang Ming Chiao Tung Univ., TW
Publicity Chairs
Asif Ali Khan, TU Dresden, DE
Christian Hakert, TU Dortmund, DE
Social Media Chair
Fanxin Kong, University of Notre Dame, US
Industry Engagement Committee Chair
Sudeep Pasricha, Colorado State University, US
✦
✦
✧
投稿说明
✦
ESWEEK 2026提供两种发表渠道:
(1) 期刊论文:篇幅不超过12页的完整论文,采用IEEE双栏格式。论文经两轮评审后,将在 IEEE 计算机辅助集成电路与系统设计汇刊 (TCAD) 上发表。
(2) 最新成果 (LB) 论文:篇幅不超过 4 页的完整论文,采用IEEE双栏格式。论文经一轮评审后,将在IEEE嵌入式系统快报 (ESL) 上发表。
这两种渠道互不兼容。有关发表流程的更多信息,请访问:
http://www.esweek.org/author-information
关注我们
获取更多会议资讯
夜雨聆风